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Semiconductor Physics and Carrier Transport

17 Questions
GATE→2026→Electronic Devices→Semiconductor Physics and Carrier Transport
Q1
MCQ[1 Mark]
Consider carrier transport in a Zener diode in the breakdown region. Which is the dominant transport mechanism for current flow in this case?
GATE→2026→Electronic Devices→Semiconductor Physics and Carrier Transport
Q2
NAT[2 Marks]
Consider that the concentration of electrons in a semiconductor bar varies linearly from 2×1017cm−32\times10^{17}cm^{-3} at x=1 μmx=1~\mu m to 1×1016cm−31\times10^{16}cm^{-3} at x=4 μmx=4~\mu m along the x-direction. Assume that the concentration of electrons is not varying along other directions (that is along y- and z-directions). [Given: the mobility of electron is 1400 cm2V−1s−11400~cm^{2}V^{-1}s^{-1}, thermal voltage is 25 mV and electronic charge is 1.6×10−191.6\times10^{-19} Coulomb.] The density of electron diffusion current (in A/mm2)(in~A/mm^{2}) is ______ (rounded off to two decimal places)
GATE→2025→Electronic Devices→Semiconductor Physics and Carrier Transport
Q3
MSQ[1 Mark]
Which of the following can be used as an n-type dopant for silicon? Select the correct option(s).
GATE→2025→Electronic Devices→Semiconductor Physics and Carrier Transport
Q4
MCQ[2 Marks]
The intrinsic carrier concentration of a semiconductor is 2.5×1016/m32.5 \times 10^{16} / m^3 at 300 K. If the electron and hole mobilities are 0.15 m2/Vs0.15~m^2/Vs and 0.05 m2/Vs0.05~m^2/Vs, respectively, then the intrinsic resistivity of the semiconductor (in kΩ⋅mk\Omega \cdot m) at 300 K is (Charge of an electron e=1.6×10−19Ce = 1.6 \times 10^{-19} C.)
GATE→2025→Electronic Devices→Semiconductor Physics and Carrier Transport
Q5
MCQ[2 Marks]
The electron mobility μn\mu_n in a non-degenerate germanium semiconductor at 300 K is 0.38 m2/Vs0.38~m^2/Vs. The electron diffusivity DnD_n at 300 K (in cm2/scm^2/s, rounded off to the nearest integer) is (Consider the Boltzmann constant kB=1.38×10−23J/Kk_B = 1.38 \times 10^{-23} J/K and the charge of an electron e=1.6×10−19Ce = 1.6 \times 10^{-19} C.)
GATE→2024→Electronic Devices→Semiconductor Physics and Carrier Transport
Q6
MCQ[1 Mark]
For non-degenerately doped n-type silicon, which one of the following plots represents the temperature (T) dependence of free electron concentration (n)?
Figure for Question 6
GATE→2024→Electronic Devices→Semiconductor Physics and Carrier Transport
Q7
MSQ[1 Mark]
The free electron concentration profile n(x)n(x) in a doped semiconductor at equilibrium is shown in the figure. Which of the following statements is/are true?
Figure for Question 7
GATE→2024→Electronic Devices→Semiconductor Physics and Carrier Transport
Q8
NAT[2 Marks]
A non-degenerate n-type semiconductor has 5% neutral dopant atoms. Its Fermi level is located at 0.25 eV below the conduction band (ECE_C) and the donor energy level (EDE_D) has a degeneracy of 2. Assuming the thermal voltage to be 20 mV, the difference between ECE_C and EDE_D (in eV, rounded off to two decimal places) is
GATE→2023→Electronic Devices→Semiconductor Physics and Carrier Transport
Q9
MCQ[1 Mark]
In a semiconductor, if the Fermi energy level lies in the conduction band, then the semiconductor is known as
GATE→2023→Electronic Devices→Semiconductor Physics and Carrier Transport
Q10
MCQ[1 Mark]
For an intrinsic semiconductor at temperature T=0T = 0 K, which of the following statement is true?
GATE→2023→Electronic Devices→Semiconductor Physics and Carrier Transport
Q11
NAT[2 Marks]
In an extrinsic semiconductor, the hole concentration is given to be 1.5ni1.5 n_i where nin_i is the intrinsic carrier concentration of 1×1010 cm−31 \times 10^{10} \text{ cm}^{-3}. The ratio of electron to hole mobility for equal hole and electron drift current is given as _______ (rounded off to two decimal places).
GATE→2023→Electronic Devices→Semiconductor Physics and Carrier Transport
Q12
NAT[2 Marks]
In a semiconductor device, the Fermi-energy level is 0.35 eV above the valence band energy. The effective density of states in the valence band at T=300T = 300 K is 1×1019 cm−31 \times 10^{19} \text{ cm}^{-3}. The thermal equilibrium hole concentration in silicon at 400 K is _______ ×1013 cm−3\times 10^{13} \text{ cm}^{-3} (rounded off to two decimal places). Given kTkT at 300 K is 0.026 eV.
GATE→2023→Electronic Devices→Semiconductor Physics and Carrier Transport
Q13
NAT[2 Marks]
A non-degenerate n-type semiconductor has 5% neutral dopant atoms. Its Fermi level is located at 0.25 eV below the conduction band (ECE_C) and the donor energy level (EDE_D) has a degeneracy of 2. Assuming the thermal voltage to be 20 mV, the difference between ECE_C and EDE_D (in eV, rounded off to two decimal places) is
GATE→2022→Electronic Devices→Semiconductor Physics and Carrier Transport
Q14
MCQ[1 Mark]
Consider a long rectangular bar of direct bandgap p-type semiconductor... The steady state electron density at x=2 μmx=2~\mu\text{m} is
GATE→2022→Electronic Devices→Semiconductor Physics and Carrier Transport
Q15
MCQ[1 Mark]
In a non-degenerate bulk semiconductor with electron density n=1016 cm−3n = 10^{16}~\text{cm}^{-3}, the value of EC−EFn=200E_C - E_{Fn} = 200 meV... For n=0.5×1016 cm−3n = 0.5 \times 10^{16}~\text{cm}^{-3}, the closest approximation of the value of (EC−EFn)(E_C - E_{Fn}), among the given options, is
GATE→2022→Electronic Devices→Semiconductor Physics and Carrier Transport
Q16
MSQ[2 Marks]
Select the CORRECT statement(s) regarding semiconductor devices.
GATE→2022→Electronic Devices→Semiconductor Physics and Carrier Transport
Q17
NAT[2 Marks]
A p-type semiconductor with zero electric field is under illumination... The magnitude of the current density due to the photo-generated electrons at x=+2lnx = +2l_n is _______ mA/cm2\text{mA/cm}^2 (rounded off to two decimal places).
Figure for Question 17

Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices

10 Questions
GATE→2026→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q18
MSQ[1 Mark]
Consider a p-n junction diode when it is forward biased with 2 V. Which of the following is/are the correct magnitude(s) of the energy difference between quasi Fermi-levels, EfnE_{fn} in the n-side and EfpE_{fp} in the p-side?
GATE→2026→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q19
MSQ[1 Mark]
Figure shows the output characteristics of two different Bipolar Junction Transistors (BJT), BJT 1 with magnitude of Early voltage ∣VA1∣|V_{A1}|, and BJT 2 with magnitude of Early voltage ∣VA2∣|V_{A2}|. Which of the following options is/are correct regarding the Early voltages?
Figure for Question 19
GATE→2026→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q20
MSQ[2 Marks]
Consider an LED based on a direct bandgap semiconductor material with energy bandgap 1.3 eV. Given: Plank's constant, h=6.63×10−34h=6.63\times10^{-34} Js and speed of light in free space is 3×108ms−13\times10^{8}ms^{-1} In which of the following wavelength ranges the LED will NOT emit?
GATE→2025→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q21
NAT[2 Marks]
An ideal p-n junction germanium diode has a reverse saturation current of 10 μA10~\mu A at 300 K. The voltage (in Volts, rounded off to two decimal places) to be applied across the junction to get a forward bias current of 100 mA at 300 K is ______ (Consider the Boltzmann constant kB=1.38×10−23J/Kk_B = 1.38 \times 10^{-23} J/K and the charge of an electron e=1.6×10−19Ce = 1.6 \times 10^{-19} C.)
GATE→2024→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q22
MSQ[2 Marks]
Which of the following statements is/are true for a BJT with respect to its DC current gain β\beta?
GATE→2024→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q23
NAT[2 Marks]
Consider a MOS capacitor made with p-type silicon. It has an oxide thickness of 100 nm, a fixed positive oxide charge of 10−8 C/cm210^{-8}\text{ C/cm}^2 at the oxide-silicon interface, and a metal work function of 4.6 eV. Assume that the relative permittivity of the oxide is 4 and absolute permittivity of free space is 8.85×10−14 F/cm8.85 \times 10^{-14}\text{ F/cm}. If the flatband voltage is 0 V, the work function of the p-type silicon (in eV, rounded off to two decimal places) is
GATE→2024→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q24
NAT[2 Marks]
An NMOS transistor operating in the linear region has IDS=5 μAI_{DS} = 5~\mu\text{A} at VDS=0.1V_{DS} = 0.1 V. Keeping VGSV_{GS} constant, the VDSV_{DS} is increased to 1.5 V. Given that μnCoxWL=50 μA/V2\mu_n C_{ox} \frac{W}{L} = 50~\mu\text{A/V}^2, the transconductance at the new operating point is
GATE→2024→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q25
NAT[2 Marks]
The photocurrent of a PN junction diode solar cell is 1 mA. The voltage corresponding to its maximum power point is 0.3 V. If the thermal voltage is 30 mV, the reverse saturation current of the diode (in nA, rounded off to two decimal places) is
GATE→2023→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q26
MCQ[1 Mark]
For a MOS capacitor, VfbV_{fb} and VtV_t are the flat-band voltage and the threshold voltage, respectively. The variation of the depletion width (WdepW_{dep}) for varying gate voltage (VgV_g) is best represented by
Figure for Question 26
GATE→2022→Electronic Devices→Diodes, BJTs, MOS Capacitors, MOSFETs, and Optoelectronic Devices
Q27
NAT[1 Mark]
An ideal MOS capacitor (p-type semiconductor) is shown in the figure. The MOS capacitor is under strong inversion with VG=2V_G = 2 V. The corresponding inversion charge density (QIN)(Q_{IN}) is 2.2 μC/cm22.2~\mu\text{C/cm}^2. Assume oxide capacitance per unit area as Cox=1.7 μF/cm2C_{ox} = 1.7~\mu\text{F/cm}^2. For VG=4V_G = 4 V, the value of QINQ_{IN} is _______ μC/cm2\mu\text{C/cm}^2 (rounded off to one decimal place).
Figure for Question 27